Telecommunications Industry Association board members at Capitol Hill to meet with Senators and their staff to discuss critical topics to the telecommunications industry centering around the #Beadprogram #BuyAmerica #RipAndReplace

Honored to join the Telecommunications Industry Association board members at Capitol Hill to meet with Senators and their staff to discuss critical topics to the telecommunications industry centering around the#Beadprogram #BuyAmerica #RipAndReplace
The Senators welcomed and engaged us in discussing important initiatives towards bridging the digital divide and efficiently rolling out the Broadband Equity, Access, and Deployment (BEAD) program.

High-speed Internet access isn’t a luxury. It’s needed to fully engage in the economy, and it helps ensure public safety and the health of our nation. Unfortunately, too many in America lack access to affordable, reliable high-speed Internet.
The Broadband Equity, Access, and Deployment Program provides $42.45 billion to expand high-speed Internet access by funding planning, infrastructure deployment and adoption programs in all 50 states, Washington D.C., Puerto Rico, the U.S. Virgin Islands, Guam, American Samoa, and the Commonwealth of the Northern Mariana Islands.

Kanchana Raman is Vice Chair of the TIA 2023-24